Elogger ™ Strain Measurement System
Printed Wiring Board Strain Testing
Strain testing allows objective analysis of the strain and strain rate levels that a SMT package is subjected to during PWB assembly, test and operation.
The Elogger™ Strain Measurement System is special design for printed wiring board strain testing application, The real-time data provided by the Elogger system avoid the risk such failures include solder ball cracking, trace damage, pad lifting and substrate cracking during board manufacturing and test processes.
SYSTEM FEATURES & BENEFITS
• Portable Carrier, compact and lightweight.
• Connect to strain gauge and thermocouple directly
• Available for 120Ω or 350Ω quarter bridge inputs.
• High speed sampling rate up to 50K Hz per channel
• Simultaneous sampling with anti-aliasing filter and analog-to-digital conversion for each channel.
• PC-Based mainframe provide Hi-Speed USB interface.
• Mainframe support various type modules.
• Meet hardware requirement of IPC/JEDEC 9704 & 9702.
Controller
|
model |
apperance |
slots |
dimensions（LxHxW） |
weight
（full installed）
|
|
EL-110 |
|
8 |
260 x 105 x 104 mm |
3.5 kg |
|
EL-210 |
|
4 |
163 x 105 x 102 mm |
2.2 kg |
|
EL-310 |
|
1 |
145 x 105 x 104 mm |
0.8 kg |
|
General |
|
|
Operating Temperature |
-40℃ - 70℃ |
|
Storage Temperature |
-40℃ - 85℃ |
|
Maximum Altitude |
5000m |
| Operating Relative Humidity |
10% - 90% |
|
interface |
USB 2.0 |
|
Max Measuring unit |
4 |
|
Power Requirement |
|
|
Input Voltage Range |
100 VAC-240 VAC |
|
Shock and Vibration |
|
|
Operational Shock |
50g |
|
Random Vibration |
10 Hz – 500 Hz |
|
Random Operating Frequency Range |
5 g |
Modules
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|
Model |
Measurement
type |
Measurement
objects |
Measuring Range
|
No.of Channel
|
Sampling Rate
(Pre Channel) |
A/D Resolution
|
Accuracy |
|
12QB8 |
Strain |
120Ω strain gauge |
±55,000μɛ |
8 Ch |
10,000 Hz |
24 bit |
±0.02% |
|
35QB8 |
Strain |
350Ω strain gauge |
±55,000μɛ |
8 Ch |
10,000 Hz |
24 bit |
±0.02% |
|
IEPAC4 |
IEPE |
Accelerometer |
±5V |
4 Ch |
50,000 Hz |
24 bit |
±0.05% |
|
DCR4-IN
DCR3-OUT
(2 slot soccupy)
|
Resistance |
Daisy-Chain |
0~10Ω
0~100Ω
0~1000Ω
|
4 Ch |
100,000 Hz |
16 bit |
±1.3% |
|
TC4 |
Thermo |
Thermocouple |
8mV |
4 Ch |
3 Hz |
24 bit |
±0.1℃ |
|
TRI8 |
Digital I/O |
TTL in & out |
5V |
8 Ch |
10 Mega Hz |
* |
* |
|
TDA50K4 |
Full-Bridge |
Transducer |
±25mV/V |
4 Ch |
50,000 Hz |
24 bit |
±0.02% |
|
V01M4 |
Voltage |
Voltage type |
±10V |
4 Ch |
100,000 Hz |
16 bit |
±0.02% |
|
FB4 |
Strain |
120 & 350Ω
strain gauge |
±55,000μɛ |
4 Ch |
50,000 Hz |
24 bit |
±0.02% |
|
HSV05M4 |
Voltage |
Voltage type |
±10V |
4 Ch |
500,000 Hz |
16 bit |
±0.02% |
SOFTWARE FEATURES
• User friendly software with One-touch report generation function
• Languages Version selectable includes English, Simplify and Traditional Chinese.
• Data analysis as diagonal strain, Max/Min principal strain, strain rate, Qstrain.
• Easy select analysis function and display in the same page.
• Allow to set up software on different computers.
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SYSTEM CONFIGURATIONS
SGA Conditioners CONFIGURATIONS
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PRODUCT SELECTION
|
Ultra High Speed Mainframe Input Modules |
||||||||
|
Model |
Appearance |
Measurement type |
Measurement objects |
Measuring Range
|
No.of Channel |
Sampling Rate
(Pre Channel) |
A/D
Resolution |
Accuracy |
|
HSV1M4 |
|
Voltage |
SGA-11 and Voltage out type sensor |
±10V |
4 Ch |
1,000,000 Hz |
16bit |
±0.02% |
|
System Conditioners |
|
|
Model |
SGA |
|
|
|
|
No.of Channel |
12 slots |
|
Size |
264 x 164 x 83 mm |
|
Weight (full installed) |
3.6 Kg |
|
Remarks |
*SGA-11 Use only
*Output to HSV1M4 |
|
General |
|
|
Operating Temperature |
-40 °C - 70 °C |
|
Storage Temperature |
-40 °C - 85 °C |
|
Maximum Altitude |
5,000 m |
|
Operating Relative Humidity |
10 % - 90 % |
|
interface |
BNC by each channel |
|
Output type |
±5V |
|
Max Measuring unit |
4 units (48 channels) |
|
Power Requirement |
|
|
Input Voltage Range |
100 VAC - 240 VAC |
|
Shock and Vibration |
|
|
Operational Shock |
50 g |
|
Random Vibration |
10 Hz - 500 Hz |
|
Random Operating Frequency Range |
5 g |
SMT assembly process
• Board depanelization (routing) processes
• All manual handling processes
• All rework and retouch processes
• Connector installation
• Component installation
Mechanical assembly
• Heat sink assembly
• Board support/stiffener assembly
• System board integration or system assembly
Shipping Environment
• Shock and vibration test
• Drop testing test
Board test processes
• In-Circuit Test (ICT)
• Board Functional Test or equivalent functional test
Automotive
|
Car control center |
Tire pressure system |
Parking sensors |
|
|
|
|
Consumer Electronics
|
Smart phone and Pad |
Laptop |
Wearable devices |
Sever |
|
|
|
|
|
Language
Search
Inquiry Cart.JPG)
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